株式会社東京精機工作所

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株式会社東京精機工作所

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Cylindrical Grinding Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Product information

TRV60
Vertical Spindle type Rotary Grinding Machine

Specification

Diamerter of electromagnetic chuck mm 600
Effective aperture of electromagnetic chuck mm 552
Maximum swing of cover inside mm 750
Maximum distance between lower surface of new wheel and chuck surface mm 320
Vertical displacementof wheel axis mm 350
Size of wheel mm 355×80
Revolution of wheel mln-1 1,500~4,500
Longitudinal travel of table mm 490
Feeding speed of table (nonstep) mm/min 200~2,400
Revolution of table(nonstep) mm-1 3~30
Machine weight Kg About 3,500
Electric power in use (200V) (KVA) About 15

株式会社東京精機工作所

  • サポートのご相談
  • JP