株式会社東京精機工作所

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株式会社東京精機工作所

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Cylindrical Grinding Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Product information

TR80NCA
Horizontal Spindle type Rotary Grinding Machine
*Thois image is [TR60NCA].
It grinds materials such as iron and ceramics. With uniqueness of Mackensen-type metal support horizontal spindle, it enables grinding with its superior rigidness.This model is a flagship product that is a highly accurate improvement of the conventional model.

仕様

Outer diameter of permanent electromagnetic chuck mm 800
Maximum swing of cover insidea mm 950
Maximum distance between lower surface of new wheel and chuck surface mm 200
Vertical displacementof wheel axis mm 250
Tilting angle of chuck table ±3゜
Size of wheel (O.D.×thickness×I.D.) mm 355×50×127
Revolution of wheel mln-1 900~1800
Longitudinal travel of table mm 450
Feeding speed of table (nonstep) mm/min 1~2000
Revolution of table(nonstep) mm-1 20~200
Machine weight Kg 4000

株式会社東京精機工作所

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